See the Call for Papers in pdf here.
IEEE International Conference on Industrial Cyber-Physical Systems (ICPS) is to provide a platform to exchange research and innovation results, lessons learned from industrial practices associated with new paradigms and technologies. ICPS 2020 is going to be the conference series presenting the state of the art and future perspectives of Industrial Cyber-Physical Systems. The industry experts, researchers, and academics share ideas and experiences surrounding frontier technologies, breakthrough and innovative solutions and applications. The world’s industry, researchers and academia are cordially invited to participate in this exciting event and enjoy the online conference.
A number of Special Sections in leading IEEE Journals such as TII, OJIES and JESTIE, elaborating conference topics will be generated after the event. Authors of accepted papers, with a high review grade, will be invited to submit an improved/modified version of their papers for further consideration.
Track 1: ICPS Architectures
Industry Architectures, Industry Standards, RAMI 4.0, Industrial IoT.
Track 2: ICPS Technologies
Core Technologies, Interoperability, Communication Networks, Connectivity OT/IT, Semantics, Control, Security, IoT/IoS, Machine Learning, Autonomous Systems, Cloud-Fog Computing, Big/Smart Data, Security.
Track 3: ICPS Engineering
Engineering Methods and Tools, Lifecycle Management, Integration, HMI, Safety, Engineering Systems of ICPS.
Track 4: ICPS Applications
Smart Manufacturing, Robotics, Smart Cities, Energy / Smart Grid, Smart Living, Smart Farming, Mobility, Water Management, Mining, Oil & Gas, Intelligent Enterprise, Smart Transportation, Internet of Underwater Things, Smart Medical Systems.
Track 5: ICPS Management and Ecosystem
Innovation Management, Innovation Ecosystems, Visions/Roadmaps, Industry Digitalization, Strategies & Markets, Entrepreneurship.
Track 6: ICPS Education and Social Aspects
Digital Society, Education, Lifelong ICPS Learning, ICPS Curricula, Social Aspects, Sustainability, Machine Ethics
Track 7: Work-In-Progress Track
Short papers (4 pages) on all ICPS areas (check details in https://events.tuni.fi/icps2020/work-in-progress-wip-guidelines/)
Special Sessions: Special sessions can cover subjects or cross-subjects belonging to the topics of interest, or novel topics related with the ones identified within the topics of interest. Proposals for special sessions are submitted to the Special Session Chairs, at email@example.com
See approved Special Sessions here.
Tutorials: Several tutorials are planned on the latest trends in industrial electronics and industrial informatics. If you are interested in organizing a tutorial, please contact Tutorials Co-Chairs at firstname.lastname@example.org
Submission of Papers:
The working language of the conference is English. Prospective participants are requested to electronically submit full papers of their work following the instructions available on the website. Accepted, registered, and presented papers will be IEEE copyrighted and published in the conference proceedings. The proceedings is planned to be submitted for inclusion in IEEE Xplore® Digital Library and therefore indexed by EI Compendex. In order for the accepted paper to be submitted for inclusion into the IEEE Xplore® Digital Library, all of the following requirements must be satisfied: 1. Appropriate publication materials: final paper and transfer of copyright to IEEE must be submitted. 2. At least one full registration has to be paid. 3. The paper must be presented at the conference. The maximum number of pages for conference papers is 6 (+2) pages, and for Work in Progress papers is 4 pages.
Special Session Proposals: January 10, 2020 (firm deadline)
Paper and Work in Progress Submission:
January 20, 2020 > February 10, 2020> February 18, 2020
Notification of Acceptance:
March 31, 2020 > April 6, 2020
Tutorial Proposals: February 15, 2020
Camera-Ready Submission and Registration of Authors:
April 15, 2020 >
May 4, 2020
Late Registration: June 2, 2020
Video Submission for presentation at Online Conference: May 22, 2020